Product: | Anti Metal 6025 | |||||||||
RFID Chip: | NXP Ucode8, NXP Ucode9, Impinj R6, Impinj R6A and more. | |||||||||
Tag Size: | 60*25mm | |||||||||
Application: | RFID tags used in metal environments | |||||||||
Protocol: | ISO/IEC 18000-6C, EPCglobal Class 1 Gen 2 | |||||||||
Operating Frequency: | 860~960MHz | |||||||||
Memory: | 48 bit TID, 96 bit EPC, 0 bit User Memory | |||||||||
Application overview: | These labels can be pasted on supermarket shelves or on computers | |||||||||
Range of Application | Asset Management, Logistics Management, Industrial management, Medical management |
Product Type: | RFID Anti Metal Tag | |||||||||
Chip Material: | Silicon Wafer | |||||||||
Face Material: | White PET | |||||||||
UHF Antenna: | AL+PET | |||||||||
MOQ: | 1,000 Pcs | |||||||||
Samples: | 10 Pcs for free samples | |||||||||
Printing: | Thermal transfer printing |
Packing specification: | Esd bag vacuum packing (Other Custom Packing specification) | |||||||||
Quantity For Per Roll: | 500 pcs/roll | |||||||||
carton size: | 445*445*345mm | |||||||||
Unwinding Direction: | Label face out | |||||||||
Core Inner Diameter: | 3 inches |
Operating Temperature/Humidity: | -40°C to + 85°C / 20%~60% RH | |||||||||
Storage Temperature/Humidity: | 20~30℃ / 20%~60% RH | |||||||||
Shelf Life: | 1 year in anti-static bag at 20~30℃ / 20% ~60% RH | |||||||||
ESD Voltage Immunity: | 2 kV (HBM) | |||||||||
Bending Diameter: | > 50mm | |||||||||
Other application environment requirements: | Metal in the environment is the main factor affecting the performance of RFID tags. The design of RFID anti-metal tag can effectively isolate RFID electronic components from the direct contact with metal objects, improve the reading distance of RFID tags in the metal environment. XGSun will design different sizes & different chip RFID anti metal tags according to the actual use of customer requirements. |
Custom Chip: | NXP Ucode8, NXP Ucode9, Moza M730, Moza M750 and more. | |||||||||
Custom Size | 65*35mm, 100*40mm, 65*5mm, 70*25mm and more. |